姓名：范剑锋
职称：副研究员
硕导：是
邮箱：jf.fan@wit.edu.cn, jffanscut@163.com
地址：武汉工程大学（武昌校区）才创楼（原材料楼）220
教育及工作经历
2026.04-至今：武汉工程大学，副研究员
2024.01-2026.04：中国科学院深圳先进技术研究院/深圳先进电子材料国际创新研究院，副研究员
2023.07-2023.12：中国科学院深圳先进技术研究院/深圳先进电子材料国际创新研究院，助理研究员，入选“鹏城孔雀计划”
2021.07-2023.07：中国科学院深圳先进技术研究院/深圳先进电子材料国际创新研究院，博士后/助理研究员
2016.09-2021.06：华南理工大学，材料科学与工程，博士（硕博连读）
2012.09-2016.07：聊城大学，高分子材料与工程，本科
研究方向
聚合物基胶黏剂
先进电子封装材料
高分子材料功能化及应用
主讲课程
《聚合物加工原理》
学生培养
每年招收硕士生2~3名，欢迎对聚合物基胶黏剂的高性能化和多功能化感兴趣的同学咨询、报考。
科研项目
1.国家自然科学基金青年科学基金项目，30万，2024.01 - 2026.12, 主持
2.中国博士后科学基金会面上项目，8万， 2022.07- 2023.06, 主持
3.广东省自然科学基金面上项目，10万，2023.01-01 - 2025.12-31, 主持
4.广东省自然科学基金面上项目，10万，2025.01- 2027.12, 主持
5.深圳市出站博士后科研资助，30万，2024.03- 2027.03, 主持
6.广东省高分子先进制造技术及装备重点实验室开放课题，3万，2022.01- 2023.12, 主持
代表性成果
围绕聚合物基胶黏剂的高性能化和多功能化，重点关注有机硅导热凝胶的制备及其作为热界面材料的应用问题。目前在Advanced Materials、Advanced Functional Materials、Small和Chemical Engineering Journal等国际知名期刊以一作/通讯作者发表论文27篇，其中SCI论文21篇；申请/授权国内发明专利23项（已授权4项）。
近5年代表性论文：
1.Weijian Wu#, Jianfeng Fan #*, Chen Zeng, Xiaxia Cheng, Xiaowei Liu, Shifeng Guo, Rong Sun, Linlin Ren*, Zhifeng Hao*, Xiaoliang Zeng*, Soft, Tough, Antifatigue Fracture Elastomer Composites with Low Thermal Resistance through Synergistic Crack Pinning and Interfacial Slippage, Advanced Materials, 2024, 2403661. (Q1，TOP，IF = 27.4)
2.Linfeng Cai#, Jianfeng Fan#, Shengchang Ding, Dongyi He, Xiangliang Zeng, Rong Sun, Linlin Ren*, Jianbin Xu*, Xiaoliang Zeng*, Soft Composite Gels with High Toughness and Low Thermal Resistance through Lengthening Polymer Strands and Controlling Filler, Advanced Functional Materials, 2022, 2207143. (Q1，TOP，IF = 19.9)
3.Jianfeng Fan, Shengchang Ding, Xiangliang Zeng, Shan Gao, Zhibin Wen, Xiaoliang Zeng, Rong Sun, Linlin Ren*, Gecko-inspired adhesive structures enable efficiently thermal conductance and vibration dissipation in a highly mismatched system. Chemical Engineering Journal 2022, 445: 136754. (Q1，TOP，IF = 16.7)
4.Jianfeng Fan, Chunyu Wong, Weijian Wu, Yu Zhou, Shengchang Ding, Linfeng Cai, Zhibin Wen, Rong Sun, Xiaoliang Zeng, Linlin Ren*, Toward soft, stretchable and resilient high filled composite gels for potential application as thermal interface materials, Composites Science and Technology, 242 (2023) 110206. (Q1，TOP，IF = 9.1)
5.Jianfeng Fan, Jiarong Huang, Zhou Gong, Liming Cao, Yukun Chen*, Toward Robust, Tough, Self-Healable Supramolecular Elastomers for Potential Application in Flexible Substrates, ACS Applied Materials & Interfaces, 2021, 13(1): 1135-1144. (Q1，TOP，IF = 8.8)
6.Jianfeng Fan, Yu Zhou, Shengchang Ding, Yunsong Pang, Xiangliang Zeng, Shifeng Guo*, Jianbin Xu*, Linlin Ren, Rong Sun, and Xiaoliang Zeng*, Thermally Conductive Elastomer Composites with High Toughness, Softness, and Resilience Enabled by Regulating Interfacial Structure and Dynamics. Small 2024, 2402265. (Q1，TOP，IF = 13)
7.Jianfeng Fan, Jiarong Huang, Mengwen Yan, Zhou Gong, Liming Cao*, Yukun Chen*, Thermoplastic multifunctional polysiloxane-based materials from broad gradient-transition multiphase separation, Journal of Materials Chemistry A, 2020, 8(32): 16376-16384. (Q1，TOP，IF = 11.3)
8.Jianfeng Fan, Weijian Wu, Xiangliang Zeng, Jiahao Zhang, Huanhuan Zhang*, Hezhi He*, Dual Reversible Network Nanoarchitectonics for Ultrafast Light Controlled Healable and Tough Polydimethylsiloxane-Based Composite Elastomers, ACS Applied Materials & Interfaces, 2023, 15, 38996−39007. (Q1，TOP，IF = 9.5)
9.Jianfeng Fan, Dongliang Ding, Chunyu Wong, Xiangliang Zeng, Jianbin Xu, Xiaoxin Lu, Xiaoliang Zeng*, Rong Sun*, Thickness-Dependent Macroscopic Properties of Highly Filled Composite Elastomers: Role of Hierarchical Filler Network and Viscoelastic Behavior. Nano Lett. 2025, 25, 17058-17065. (Q1，TOP，IF = 9.1)
10.Jianfeng Fan, Zhou Gong, Yukun Chen*, Design of strong fluorosilicone composites via thermodynamic and kinetic regulation of SiO2, Composites Communications, 35 (2022) 101273. (Q1，IF = 7.7)
11.Jianfeng Fan, Xinqin Zhou, Yukun Chen*, Multiple hierarchical dynamic interactions enabled a robust, stretchable and room temperature selfhealing elastomer, Polymer Chemistry, 2023, 14(17): 2117-2125. (Q2，IF = 4.6)
12.Jianfeng Fan, Mengwen Yan, Jiarong Huang, Liming Cao, Yukun Chen*, Fabrication of Smart Shape Memory Fluorosilicon Thermoplastic Vulcanizates: The Effect of Interfacial Compatibility and Tiny Crystals, Industrial & Engineering Chemistry Research, 2019, 58, 15199−15208. (Q2，IF = 3.4)
13.Jianfeng Fan, Jiarong Huang, Liming Cao, Shiheng Yin*, Yukun Chen*, Mechanically Robust, Reprocessable Shape Memory Fluorosilicon Materials Using beta-H Elimination Reaction and in Situ Interfacial Compatibilization, Industrial & Engineering Chemistry Research, 2020, 59(28): 12745-12754. (Q2，IF = 3.6)
14.Jianfeng Fan, Liming Cao, Jiarong Huang, Daosheng Yuan*, Yukun Chen*, The construction and verification of toughening model and formula of binary poly(lactic acid)-based TPV with co-continuous structure, Materials Chemistry and Physics, 231 (2019) 95–104. (Q2，IF = 2.8)
15.Jianfeng Fan, Zhenqiang Ye, Xiaoliang Zeng*, Jian-Bin Xu*, Linlin Ren*, Rong Sun, Ching-Ping Wong, Predicting bond line thickness of polymeric thermal interface materials based on the rheological properties. Journal of Applied Physics. 136, 025301 (2024). (Q2，IF = 2.7)
16.Xiangchao Xie, Jianfeng Fan#*, Chen Zeng, Ke Ou, Yabiao Ma, Gaohong Lv, Jianbin Xu, Rong Sun, Xiaoliang Zeng*,Thermally conductive under-liquid adhesives via the synergistic effect of intrinsic interfacial toughness and mechanical dissipation. Materials Horizons. 2025, 12, 7606-7617. (Q1，IF = 10.7)
17.Yabiao Ma, Jianfeng Fan*, Yuanyuan Xiao, Jiahui Wang, Shujun Cai, Gaohong Lv, Xiangchao Xie, Siyuan Cheng, Shifeng Guo, Linlin Ren, Jianbin Xu, Rong Sun, Xiaoliang Zeng, Fractal network design for soft, tough, antifatigue elastomer composites with high thermal conductivity. Composites Part B 2026, 312, 113307. (Q1，IF = 14.2)
18.Jiahui Wang, Shujun Cai, Yabiao Ma, Jian-Bin Xu, Jianfeng Fan*, Xiaoliang Zeng, Rong Sun, Multiscale filler network design enables solid–liquid reversible thermal interface materials with high thermal conductivity and low thermal resistance. Composites: Part A 2026, 201, 109422. (Q1，IF = 8.9)
19.Xinqin Zhou, Zhou Gong, Jianfeng Fan*, Yukun Chen*, Self-healable, recyclable, mechanically tough transparent polysiloxane elastomers based on dynamic microphase separation for flexible sensor, Polymer, 237 (2021) 124357. (Q2，IF = 4.4)
20.Weijian Wu#, Jianfeng Fan#, Yunsong Pang, Cheng Zhong, Rong Sun, Xiaoliang Zeng*, Zhifeng Hao*, Soft, Tough and Thermally Conductive Elastomer Composites by Constructing Curled Conformation. Chemistry of Materials. 2023, 35, 7500−7510. (Q1，TOP，IF = 8.6)
21.Shengchang Ding#, Jianfeng Fan#, Dongyi He, Linfeng Cai, Xiangliang Zeng, Linlin Ren*, Guoping Du*, Xiaoliang Zeng*, Rong Sun, High thermal conductivity and remarkable damping composite gels as thermal interface materials for heat dissipation of chip. Chip 2022, 1, 100013 (Q1，IF = 7.1，封面副标题报道).
22.Jiada Nie#, Jianfeng Fan#, Zhou Gong, Chuanhui Xu*, Yukun Chen*, Frame-structured and self-healing ENR-based nanocomposites for strain sensors. European Polymer Journal, 154 (2021) 110569. (Q1，IF = 4.6)
23.Jianfeng Fan, Weijian Wu, Xiangliang Zeng, Yunsong Pang, Yu Zhou, Rong Sun, Xiaoliang Zeng, Linlin Ren*, Experimental validation of a simple fractional model for viscoelastic behavior of high filled polymer-based composites. 2023 24th International Conference on Electronic Packaging Technology (ICEPT), 2023. (EI)
24.Jiahui Wang, Gaohong Lv, Shujun Cai, Jianfeng Fan*, Design and Research of High Thermal Conductivity, Yield-Tunable Silicone Thermal Interface Materials. 2025 26th International Conference on Electronic Packaging Technology (ICEPT), 2025. (EI)
25.Shujun Cai, Jiahui Wang, Yabiao Ma, Siyuan Cheng, Linlin Ren*, Jianfeng Fan*, Effect of Gradient Aluminum Nitride Particles on Thermal Conductivity and Rheological Performance of Thermal Conductive Gel. 2025 26th International Conference on Electronic Packaging Technology (ICEPT), 2025. (EI)
26.Weijian Wu, Hangqian Wang, Xiangliang Zeng, Zhifeng Hao, Jianfeng Fan*, Linlin Ren*, High energy dissipation composite elastomer for application as a thermal interface material through solvent-induced dis-entanglement. 2023 24th International Conference on Electronic Packaging Technology (ICEPT), 2023. (EI)
27.Shengchang Ding, Dongyi He, Linfeng Cai, Xiangliang Zeng, Xiaoliang Zeng, Linlin Ren*, Guoping Du, Jianfeng Fan*,Optimizing Thermal Properties of Thermal Interface Materials Using the Adhesion Mechanism of Gecko’s Setae. 2022 23rd International Conference on Electronic Packaging Technology (ICEPT), 2022. (EI)
专利
1.陈玉坤，范剑锋. 发明专利：多功能性的聚硅氧烷热塑性弹性体及其制备方法与应用. 发明专利,申请号：202010049369.7.（已授权）
2.陈玉坤，范剑锋. 发明专利：兼具高机械性能和自修复功能的聚硅氧烷超分子弹性体及其制备方法与应用. 发明专利, 申请号：202010879278.6. （已授权）
3.曾小亮，蔡林峰，任琳琳，伍勇东，范剑锋，孙蓉. 一种导热凝胶及其制备方法. 发明专利, 申请号：202210048962.9.（已授权）
4.范剑锋，曾小亮，张新悦，邵泽凡，孙蓉. 一种高导热低粘结层厚度的导热凝胶及其制备方法和应用. 发明专利, 申请号：202610504717.2.
5.范剑锋，曾小亮，孙蓉. 一种高导热复合垫片及其制备方法和应用. 发明专利, 申请号：202610334065.2.
6.范剑锋，曾小亮，邵泽凡，张新悦，孙蓉. 一种有机硅导热凝胶复合材料及其制备方法和应用. 发明专利, 申请号：202511601402.1.
7.范剑锋，曾小亮，庞云嵩，曾晨，孙蓉. 有机硅导热凝胶及其制备方法、导热材料及应用. 发明专利, 申请号: 202510087677.1.
8.范剑锋，任琳琳，曾小亮，丁声昌，文志斌，艾代峰，孙蓉. 一种宽频带宽温域高阻尼的导热凝胶及其制备方法和应用, 发明专利, 申请号：202210170545.1.
9.范剑锋，任琳琳，吴伟健，曾小亮，何彬，艾代峰，孙蓉. 一种兼具高阻尼、高回弹性能的导热凝胶及其制备方法. 发明专利, 申请号: 202310956443.7.
10.曾小亮，范剑锋，张新悦，孙蓉. 一种导热凝胶及其制备方法和应用. 发明专利, 申请号：202610503782.3.
11.曾小亮，范剑锋，孙蓉. 一种导热凝胶界面材料及其制备方法和应用. 发明专利, 申请号：202610334064.8.
12.任琳琳，范剑锋，何冬逸，纪迎港，文志斌，曾小亮，胡煜琦，孙蓉. 一种高导热自修复热界面材料及其制备方法, 发明专利, 申请号：202210282833.6.
13.任琳琳，范剑锋，丁声昌，曾小亮，胡煜琦，何彬. 一种兼具高导热和阻尼功能的导热凝胶及其制备方法和应用, 发明专利, 申请号：202111455661X.
14.曾小亮，程思远，范剑锋，孙蓉. 一种低密度高导热固液转变型聚合物基热界面材料及其制备方法和应用. 发明专利, 申请号：202610334066.7.
15.曾小亮，蔡淑君，范剑锋，庞云嵩，孙蓉. 一种有机硅导热材料及光模块. 发明专利, 申请号: 202411993913.8.
17.任琳琳，吴伟健，范剑锋，曾小亮，孙蓉. 一种热界面材料及其制备方法和应用. 发明专利,申请号: 202311191798.8.
18.任琳琳，文志斌，范剑锋，莫平菁，纪迎港，曾小亮，孙蓉. 一种本征高柔性、高导热液晶弹性体材料及其制备和应用. 发明专利, 申请号：202210116289.8.
19.庞云嵩，曾小亮，吕高鸿，范剑锋，孙蓉. 一种光模块用导热材料的器件级导热可靠性验证方法. 发明专利, 申请号：2025116014021.
20.曾小亮，魏逸民，庞云嵩，范剑锋，陈俊杰，盛佳硕，谢响潮，孙蓉. 有机硅散热材料及光模块. 发明专利, 申请号: 202411842619.7.
21.曾小亮，魏逸民，庞云嵩，范剑锋，欧可，章志安，程思远，孙蓉. 导热有机硅复合材料及电子设备. 发明专利, 申请号: 202411842620.X.
22.文志斌，任琳琳，曾小亮，范剑锋，纪迎港，艾代峰，孙蓉. 一种热界面材料及其制备方法和应用. 发明专利, 申请号: 202410321643.X.
23.曾小亮，谢响潮，蔡淑君，王家辉，魏逸民，范剑锋，孙蓉. 一种液下热界面材料及其制备方法和应用. 发明专利, 申请号：2025111925201.
